Products

COB P0.9/1.2/1.5 Matte Series

Adopts RGB full flip-chip packaging technology, with high heat dissipation efficiency and high reliability.
Innovative surface treatment process enhances image contrast and ink color consistency.
Uniform light emission delivers a more comfortable viewing experience.

Details

PanQ light Technology COB P0.9 P1.2 P1.5 Matte Series(1).jpg


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